線(通道)：conduction (track)
導線(體)寬度：conductor width
導線距離：conductor spacing
導線層：conductor layer
導線寬度/間距：conductor line/space
第一導線層：conductor layer No.1
圓形盤：round pad
方形盤：square pad
菱形盤：diamond pad
長方形焊盤：oblong pad
子彈形盤：bullet pad
淚滴盤：teardrop pad
雪人盤：snowman pad
V形盤：V-shaped pad
環(huán)形盤：annular pad
非圓形盤：non-circular pad
隔離盤：isolation pad
非功能連接盤：monfunctional pad
偏置連接盤：offset land
腹(背)*盤：back-bard land
盤址：anchoring spaur
連接盤圖形：land pattern
連接盤網格陣列：land grid array
孔環(huán)：annular ring
元件孔：component hole
安裝孔：mounting hole
支撐孔：supported hole
導通孔：via
鍍通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意層內部導通孔：any layer inner via hole (ALIVH)
全部鉆孔：all drilled hole
定位孔：toaling hole
無連接盤孔：landless hole
中間孔：interstitial hole
無連接盤導通孔：landless via hole
引導孔：pilot hole
端接全隙孔：terminal clearomee hole
準表面間鍍覆孔：quasi-interfacing plated-through hole
準尺寸孔：dimensioned hole
在連接盤中導通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔圖：hole pattern
鉆孔圖：drill drawing
裝配圖：assembly drawing
印制板組裝圖：printed board assembly drawing
參考基準：datum referan
